Welcome Message

General Chair
Yong Chul Park


 

General Co-Chair
Yeong K. Kim

Dear Colleagues,

It is our pleasure to announce that the 17th international Symposium on Microelectronics and Packaging (ISMP 2018) will be held at COEX convention center, Seoul, Korea, on October 24-26, 2018. This international conference is organized by KMEPS (the Korean Microelectronics and Packaging Society), and will address comprehensive coverage of recent advances in electronic packaging process and materials. Three days of technical sessions for oral and poster presentations will be in parallel with the 20th International Semiconductor Exhibition (http://www.sedex.org) at COEX. This will provide an excellent opportunity for researchers and engineers of academic institutes and industries to discuss recent advances and new technology directions. Particularly, the special session for Fan-out Packaging will be the highlight this year. Also, you can enjoy the wonderful night view of the Han River at the dinner cruise for the banquet. We cordially invite you to submit abstracts for the conference, and look forward to welcoming you in Seoul, Korea.

Yong Chul Park,
C.E.O of Amkor Korea
General Chair
Yeong K. Kim
Professor, Inha University
General Co-Chair