The ISMP (International Symposium on Microelectronics and Packaging) is a premier international conference for discussing new inventions and exchanging information and ideas among global researchers from electronic packaging, electronic materials and microelectronic devices. ISMP is organized by KMEPS(Korea Microelectronics and Packaging Society). The ISMP2018 will be held at COEX, Seoul, Korea, during Oct 24 – 26, 2018, featuring about 20 technical sessions (oral presentations, interactive presentations, and student posters).

Title The 17th International Symposium on Microelectronics and Packaging
Date Oct. 24 – 26, 2018
Venue 3F, Conference Room E1~4, COEX, Seoul, Korea
Host Korea Microelectronics and Packaging Society
Program Welcome Reception, Plenary &Invited & Oral & Poster Presentations, Banquet
Website www.ismp2018.org
Offcial Language English
Key Dates
Abstract submission May 31 2018
Acceptance notification June 30 2018
Pre-registration Sep 17 2018
Manuscript submission Oct 31, 2018
Secretariat KMEPS(Korea Microelectronics and Packaging Society)
Rm 505, Main B/D, The Korea Science & Technology Center, 22, 7gil, Teheran-ro,
Gangam-gu, Seoul 06130, Korea
Tel : +82-2-538-0962
E-mail : kmeps@kmeps.or.kr
Publication Policy

The selected full manuscripts are going to be published in Nanoscience and Nanotechnology Letter(NNL) or Jounal of Nanoscience and Nanotechnology(JNN), 2019 after the ISMP2018