ISMP 2018 will include all fundamental and applied sciences and technologies related to the fields of electronic materials, devices, and packaging. Topics may include from, but are not limited to, the following areas:

Advanced Packaging Technologies

  • Challenges and solutions in fan-out/fan-in wafer level packaging, panel level packaging, 3D integration, embedded structures, micro-bonding, TSVs, TEVs, TMVs, advanced substrates and interposers

Electronic Materials for Interconnects and Packaging

  • New interconnect materials (nano-scaled materials, nanowires, nano-interconnects, aerosol), carbon-based nanomaterials (graphene, CNT), adhesives(underfill, ACF, NCP), epoxy mold compound, bonding wire

Emerging Process for Interconnects and Packaging

  • Fine pitch bumping technology, bumpless bonding, ultrasonic bonding, induction bonding, laser bonding, self-align chip stacking, nano-bonding

PCB, Solder, and Assembly Process

  • Novel fabrication process for printed circuit board, electroplating process, surface finish, high reliable novel solder materials, low and high temperature solder, solder joint properties, interfacial reaction, solder printing process, reflow, wave soldering, press-fit process, novel assembly technologies

Power Electronic Systems Packaging

  • Bonding materials for power electronics, TLP, ribbon bonding, wide bandgap power semiconductor devices (e.g. SiC, GaN, GaAs), novel cooling solutions (e.g. double-sided cooling, bond-wire-less), power embedding, very high voltage (>6.5kV) solutions

Sensors, LED, and Emerging Packaging System

  • Biosensor, chemical sensor, nano-packaging, emerging packaging technologies for bio-electronics and microfluidics, micro LED

Wearable and Printed Electronics

  • Stretchable electronic devices, stretchable substrates, flexible hybrid systems, printed/jetted (transparent) conductors, touch and large area sensors, signage and displays, paper electronics, printed thin film PV and photodetectors, energy storage and harvesting, wearable sensors/actuators

MEMS/NEMS Packaging and Applications

  • Challenges and solutions in processing, integration and packaging, new packaging approaches, TSVs in MEMS, bonding technologies, wafer bonding, micro-bonding

Reliability of Electronic Devices and Systems

  • New results at different levels of system integration (chip contacts, packages, assemblies and subsystems), characterization and test, failure diagnostic, methodical and equipment developments, upcoming challenges due to new system integration demands, innovative materials and extended application fields

Design Tools and Modeling

  • Mechanical, electrical, and thermal modeling and experimental verifications, signal and power integrity