Poster Presentation

Poster Presentation Session I – Oct. 25, 2018(Thu.)
No. Topic First Author Affiliation(First Author) Country Paper Title
P1-01 Electronic Materials for Interconnects and Packaging Youngmo Tak Seoul National University KR Effect of Ti/Ru doping in Al thin films on hillock Suppression
P1-02 MEMS/NEMS Packaging and Applications Jun Hyun Kim Pusan National University KR Enhancement of Plasmonic Characteristics by Metal Thickness Control
P1-03 Advanced Packaging Technologies Kwang-Ho Jung Sungkyunkwan University KR Microstructural Evolution and Electrical Property of the Photonic Sintered Metal Patterns with Heat-curable Insulator
P1-04 Sensors, LED, and Emerging Packaging System Sung-Kyu Kim POSTECH KR Development of humidity sensor testing platform
P1-05 Sensors, LED, and Emerging Packaging System Dong In Kim Sungkyunkwan University KR QCM sensor using 2D ZnO nanowall structures for Surface Acoustic Wave Sensor in Nerve Agent Detection sensitivity
P1-06 Sensors, LED, and Emerging Packaging System HeeSu Woo Kyonggi University KR Study on High Thermal Conductivity of CMS glass-ceramics for LED Package 
P1-07 Sensors, LED, and Emerging Packaging System Byongguk Kang Kyonggi University KR Study on High Transmittance and Thermal Conductivity of Crystallization Glass Based on Diopside by Heat Treatment Schedule and Nucleation Agent
P1-08 Sensors, LED, and Emerging Packaging System Tae Wan Ha Kyonggi University KR Study on ZrO2-CaO-MgO-SiO2 glass-ceramics with high strength and high heat dissipation characteristics for LED package
P1-09 Sensors, LED, and Emerging Packaging System Sang Hyun Jung Korea Advanced Nano Fab Center KR Development of Low Temperature Gallium Arsenide-Silicon Wafer Bonding Using Metals for Integrated Heterogeneous Hall Sensors
P1-10 Sensors, LED, and Emerging Packaging System Yoorim Rho Kyonggi University KR Study on BaO–TiO2–SiO2 System Based Glass-ceramic with Nonlinear Optical Properties
P1-11 MEMS/NEMS Packaging and Applications El-Mostafa Bourim National Nanofab Center KR Reactive Bonding Based on Integrated Reactive Nanostructured Al/Pd Multilayer Thin Film Systems for MEMS Packaging Applications 
P1-12 Wearable and Printed Electronics Ji hun Yuk Seoul National University of Science and Technology KR Stretchable Radio-Frequency Antennas Based on Highly Conductive Silver Paste
P1-13 Wearable and Printed Electronics Hyun Jin Nam Seoul National University of Science and Technology KR Development of printable stretchable strain sensor for smart gloves
P1-14 Wearable and Printed Electronics Won Jae Lee Seoul National University of Science and Technology KR Eletro-mechanical properties of screen printed stretchable electrode using laser curing method
P1-15 Wearable and Printed Electronics Won Jae Lee Seoul National University of Science and Technology KR The Electromechanical Properties of Highly Stretchable, Durable, and Printable Textile Electrode
P1-16 MEMS/NEMS Packaging and Applications Shania Rehman Sejong University PK Resistive switching characteristics of Zn doped CeO2
P1-17 Wearable and Printed Electronics Sukhun Hyun KETI KR Electrode Material for Stretchable Devices based on Silver Powder with 100% Elongation
P1-18 Advanced Packaging Technologies Dae Young Park KITECH KR Synthesis and applications of high aspect-ratio Ag nanowire for transparent electrode
P1-19 Electronic Materials for Interconnects and Packaging Gyu-Won Jeong KITECH KR Reliability of bump joint with various shapes of Cu pillar bump using electroplating
P1-20 Reliability of Electronic Devices and Systems Tae Wook Kim Andong National University KR Electrical reliability of Multi Layer Metal Electrode for Flexible Electronic Device
P1-21 Reliability of Electronic Devices and Systems Jae Geun Seol Andong National University KR Reliability study of rolling strain of Cu thin film on flexible substrate
P1-22 Advanced Packaging Technologies Soojung Kang Seoul National University of Science and Technology KR Planarization Characteristics of Polyimide as Interlayer Dielectrics for FOWLP
P1-23 Sensors, LED, and Emerging Packaging System Ariadna Schuck Sungkyunkwan University KR Fabrication of Graphene-based Field Effect Transistor for Electrical Property Characterization of Blood
P1-24 Electronic Materials for Interconnects and Packaging Gahui Kim Andong National University KR Effects of plasma treatment condition on the interfacial adhesion energy of dielectric/Ti /Cu RDL for fan-out wafer level packaging
P1-25 Sensors, LED, and Emerging Packaging System Kyunghan Yoo Dankook university KR A study on the sensitivity of indirect-type organic X-ray detector by improving conductivity of hole transport layer
P1-26 Sensors, LED, and Emerging Packaging System Hyunki Kang DanKook University KR Improved Sensitivity of Indirect-type Organic X-ray Detector Using Ag Nanoparticles
P1-27 Emerging Process for Interconnects and Packaging Changmin Song Seoul National University of Science and Technology KR Synthesis and characterization of positive-type spin-on hybrid material for dielectric application in fan out wafer level packaging
P1-28 Power Electronic Systems Packaging Byung-Suk Lee KITECH KR Feasibility Study of Various Cu-Sn Transient Liquid Phase Bonding for Power Electronics Applications
P1-29 PCB, Solder, and Assembly Process Jong-Hoon Back KITECH KR Interfacial reactions and shear strength of Sn-3.0Ag-0.5Cu/ENEPIG solder joints with different ENEPIG plating thickness and aging time  
Poster Presentation Session 2 – Oct. 26, 2018(Fri.)
No. Topic First Author Affiliation(First Author) Country Paper Title
P2-01 Reliability of Electronic Devices and Systems HyungJun Jang Korea University KR Electrostatic Discharge(ESD) by Ultra-Violet(UV) Wavelength in Wafer Scale Package
P2-02  Advanced Packaging Technologies Cheol Kim Seoul National University KR The Study of Two-Dimensional Horizontal Thermoelectric Peltier Cooling Device
P2-03 Reliability of Electronic Devices and Systems Sanghee Lee Dankook University KR Preparation and Properties of Hybrid Passivation Film Layers Coated on Cu(In,Ga)Se2 Flexible Solar Cells
P2-04 Power Electronic Systems Packaging Ji-Yeon Park KETI KR Vacuum Pb-free Soldering Property of Automotive Power Module with Silicon Carbide Device
P2-05 Electronic Materials for Interconnects and Packaging Kyung-Yeol Kim Sungkyunkwan University KR Mechanical property of Sn-58Bi solder with various contents of SAC305 solder
P2-06 Reliability of Electronic Devices and Systems Jungsoo Kim Sungkyunkwan University KR Various contents of Ni-coated Multi-walled Carbon Nanotubes reinforced Sn58%Bi solder joints under current stress
P2-07 Wearable and Printed Electronics SangWoo Kim Sungkyunkwan University KR Ultra high frequency characteristics of transparent transmission line improved by positive photoresist barrier structure
P2-08 Power Electronic Systems Packaging Kyung Deuk Min Sungkyunkwan University KR Mechanical property of pressureless transient liquid phase sintering bonding by Cu nanoparticles and Sn-58Bi particle with 85 ℃ / 85 % relative humidity environmental conditions  
P2-09 Wearable and Printed Electronics Choong Jae Lee Sungkyunkwan University KR Effects of Ethyl Cellulose content on Cu nanopastes with various binder condition
P2-10 Wearable and Printed Electronics Ping-Heng Wu National Chung Hsing University TW Silanization-assisted surface metallization of silicon 
P2-11 Wearable and Printed Electronics Ya-Ching Chang National Chung Hsing University TW Silanization-assisted metallization of glass 
P2-12 Electronic Materials for Interconnects and Packaging Arun Sasidharanpillai KICET KR Ultra Low Temperature Co-fired CaV2O6 Ceramic Substrate for Microelectronic Applications
P2-13 Electronic Materials for Interconnects and Packaging Sung Keun Chang POSTECH KR Thermal stability study of Ni-Si silicide films in Ni/SiC contact by in-situ temperature-dependent sheet resistance measurement
P2-14 Electronic Materials for Interconnects and Packaging Yong-Su Lee Hongik University KR The Effects of Plating Parameters on Ni-W Alloy Electroplating for UBM Application 
P2-15 PCB, Solder, and Assembly Process Wonil Seo Hanyang University/KITECH KR Growth Behavior of Interfacial Intermetallic Compound at ENIG/Sn-Ag-Cu Solder Joint with Structure of Ni-P layer
P2-16 Electronic Materials for Interconnects and Packaging Tae-Young Lee KITECH KR Effect of Silane Modified Resin on Coefficient of Thermal Expansion (CTE) of Non-Conductive Adhesive (NCA)
P2-17 Reliability of Electronic Devices and Systems Honggyun Kim Sejong University KR Two Different Ag Back Electrode Processes for Inverted Organic Solar Cells
P2-18 Power Electronic Systems Packaging Junhyuk Son KITECH KR A study on the Electrochemical Corrosion property of Sn-xSb Solder alloy for Automotive Power Module
P2-19 PCB, Solder, and Assembly Process Soonyong Kwon KITECH KR Slump and wetting properties of solder paste with the content of alcohol-based solvent
P2-20 Power Electronic Systems Packaging Seungju Baek KITECH KR A study on TLP bonding of power semiconductor for electric automobile
P2-21 Electronic Materials for Interconnects and Packaging Juhan Yoon KITECH KR Rheological properties of non-conductive adhesive with the contents of additives
P2-22 Reliability of Electronic Devices and Systems Yong Wook Kwon Andong National University KR Electrical Resistance Change of ITO Film in Torsional 
P2-23 Electronic Materials for Interconnects and Packaging Eun Byeol Choi Seoul National University of Science and Technology KR Die-Attach Characteristics of Paste Containing 2-μm Cu Particles Coated with Nanoscale-Thick Ag Shell
P2-24 Emerging Process for Interconnects and Packaging Haesung Park Seoul National University of Science and Technology KR Characterization of Cu surfaces by plasma treatment for wafer bonding applications 
P2-25 PCB, Solder, and Assembly Process Young Moon Jang Seoul National University of Science and Technology KR Study of Mass Reflow, Laser Reflow and Laser TCB for Flip Chip Package by Numerical Analysis